Samsung HBM4 production could more than double next year as the company reportedly raises its monthly glass-carrier cleaning volume from 20,000 sheets to 50,000. The forecast comes from Korean industry sources cited by Seoul Economic Daily and reported by Wccftech.
Samsung HBM4 production is being geared towards HBM4E
Glass carriers hold thin DRAM wafers in place during processing and can be cleaned and reused. The reported monthly requirement rose from 10,000 sheets in 2025 to 20,000 this year, then is expected to reach 50,000 in 2027. That is a 2.5-fold increase from the current level, although it indicates production activity rather than a direct count of finished memory packages.
The same report expects Samsung’s average monthly HBM wafer input to rise from about 180,000 this year to 250,000 next year, a gain of almost 40%. HBM4 and HBM4E would account for roughly 80% of the company’s HBM shipments next year, up from around 40% this year, as HBM4E moves towards mass production.
Samsung said in its official HBM4E announcement that it had started shipping 12-layer samples to major customers. The part can reach 16 Gbps per pin, offer up to 3.6 TB/s of bandwidth per stack, and use a 48GB 12-layer configuration. Those are Samsung’s product specifications; the 2027 production figures come from the industry report.
Why Samsung is expanding HBM4 capacity
HBM4 is used alongside advanced AI accelerators, where memory bandwidth is as important as the compute chip itself. The production push is arriving as Nvidia’s Vera Rubin platform and other AI systems increase demand for higher-layer memory, while Samsung, SK hynix and Micron compete for supply contracts.
For Samsung, the reported increase also reflects a broader effort to integrate its memory, foundry, and advanced-packaging operations. The company has said its HBM4 uses a 1c DRAM process and a 4nm logic base die. Samsung has not publicly confirmed the reported carrier volumes or the implied increase in output.
Samsung’s move comes after a period of tight HBM supply and wider concern about memory availability for AI data centres. Samsung has previously been reported to be locking in long-term memory-chip supply, while SK hynix has warned that the memory crunch could worsen in 2027.
What is Samsung HBM4?
Samsung HBM4 is the company’s sixth-generation high-bandwidth memory for demanding AI and high-performance computing systems.
What is a glass carrier used for in HBM production?
A glass carrier supports a thin DRAM wafer during processing, helping prevent warping or damage before the memory is assembled into a stack.
Has Samsung confirmed the 2027 HBM4 output forecast?
No. The 2027 carrier volumes and the implied output increase are reported figures attributed to sources in the Korean semiconductor industry.
